|
SANTA CLARA, Calif., Aug. 1, 2006 – Intel Corporation today
introduced its first NOR flash memory products aimed at the emerging low-cost
cell phone segment. The new products have a new pin sharing package to minimize
pin count and are configured to work with low-cost, single-chip baseband and RF
solutions from leading chipset suppliers. Major handset vendors are expected to
start introducing low-cost cell phones based on Intel flash products this
quarter.
Intel is introducing these products in response to increasing market demand
for low-cost phones. The cell phone industry's GSM Association estimates that
only 20 percent of the world's population use cell phones, largely because of
cell phone costs.
"We're expanding Intel's proven leadership in NOR flash memory for handsets
to the emerging low-cost handset market segment," said Darin Billerbeck, vice
president and general manager of Intel's Flash Products Group. "Our handset
customers can choose from a comprehensive menu of NOR flash memory products from
32Mb density at the low end to 1Gb density for multi-media cell phones.
"We view the low-cost handset market segment as an ongoing growth opportunity
and we have a migration path in place to transition our products from 130nm and
90nm process technology to 65nm process technology in 2007," Billerbeck
added.
Intel's products for the low-cost handset market segment feature
cost-efficient, lower density NOR flash memory products from 32Mb to 256Mb with
optional RAM in a multi-chip package. These products include a common 88-ball
QUAD+ package with an address-data multiplexed (A/D Mux) configuration that
simplifies the design-in process, enabling faster time-to-market and lower
design costs. These memory solutions are expected to evolve to also support the
common 107-ball x 16C package with an A/D Mux configuration. To enable
accelerated design cycles, Intel offers a portable Low-Cost Handset Design Kit,
which includes a design guide, product datasheets and migration guides, at
www.intel.com/design/flash/nor/lc_handset/overview.htm. Available in both
single-chip and multi-cell packages, the products are sampling to customers now
and will be in volume production in the third quarter this year.
More Interesting News
|
